RUANGSINCHAIWANICH, S.; INTACHAI, S.; INPHOU, M. The finite element analysis of factors affecting deformation of solder bumps. Asia-Pacific Journal of Science and Technology, [S. l.], v. 13, n. 3, p. 317–322, 2017. Disponível em: https://so01.tci-thaijo.org/index.php/APST/article/view/83056. Acesso em: 30 sep. 2026.