RUANGSINCHAIWANICH, S.; INTACHAI, S.; INPHOU, M. The finite element analysis of influence of heat transfer on material components of solder bumps. Asia-Pacific Journal of Science and Technology, [S. l.], v. 13, n. 4, p. 484–488, 2017. Disponível em: https://so01.tci-thaijo.org/index.php/APST/article/view/83711. Acesso em: 30 sep. 2026.