ONPIMAI, J.; TANGCHAICHIT, K. A study on force affecting the head stack assembly (HSA) in ultra sonic tab bond process. Asia-Pacific Journal of Science and Technology, [S. l.], v. 16, n. 2, p. 196–202, 2017. Disponível em: https://so01.tci-thaijo.org/index.php/APST/article/view/83205. Acesso em: 18 may. 2024.