ONPIMAI, J.; TANGCHAICHIT, K. A study on factors affecting the Head Stack Assembly (HSA) in ultra sonic tab bond process. Asia-Pacific Journal of Science and Technology, [S. l.], v. 16, n. 4, p. 391–397, 2017. Disponível em: https://so01.tci-thaijo.org/index.php/APST/article/view/83240. Acesso em: 21 may. 2024.