Ruangsinchaiwanich, S., Intachai, S. and Inphou, M. (2017) “The finite element analysis of factors affecting deformation of solder bumps”, Asia-Pacific Journal of Science and Technology, 13(3), pp. 317–322. available at: https://so01.tci-thaijo.org/index.php/APST/article/view/83056 (accessed: 29 September 2026).