Onpimai, J., and K. Tangchaichit. “A study on force affecting the head stack assembly (HSA) in ultra sonic tab bond process”. Asia-Pacific Journal of Science and Technology, vol. 16, no. 2, Apr. 2017, pp. 196-02, https://so01.tci-thaijo.org/index.php/APST/article/view/83205.