Onpimai, J., and K. Tangchaichit. “A Study on Factors Affecting the Head Stack Assembly (HSA) in Ultra Sonic Tab Bond Process”. Asia-Pacific Journal of Science and Technology, vol. 16, no. 4, Apr. 2017, pp. 391-7, https://so01.tci-thaijo.org/index.php/APST/article/view/83240.