Ruangsinchaiwanich, Somporn, Suchada Intachai, and M. Inphou. “The finite element analysis of influence of heat transfer on material components of solder bumps”. Asia-Pacific Journal of Science and Technology 13, no. 4 (April 19, 2017): 484–488. accessed January 6, 2026. https://so01.tci-thaijo.org/index.php/APST/article/view/83711.