Onpimai, Jeeraporn, and Kiatfa Tangchaichit. “A Study on Force Affecting the Head Stack Assembly (HSA) in Ultra Sonic Tab Bond Process”. Asia-Pacific Journal of Science and Technology 16, no. 2 (April 13, 2017): 196–202. Accessed May 19, 2024. https://so01.tci-thaijo.org/index.php/APST/article/view/83205.