The finite element analysis of factors affecting deformation of solder bumps

Abstract

Deformation of components in IC die packages has been found more often due to the reduction of IC die package size in hard disc drive (HDD). Therefore, this research aims to study and analyze the factors affecting deformation of solder bumps in the IC die package. Particularly, the position of simple solder bumps is studied asymmetrically. The finite element method is a significant tool in this study for analyzing the stress and strain in solder bumps, which is affected by the heat reflow process. The results show that position and density of solder bumps in an IC die package are the significant factors affecting deformation of solder bumps