The finite element analysis of influence of heat transfer on material components of solder bumps

Abstract

Deformation of components in IC die packages with the heat transfer in material components of solder
bumps is investigated by finite element analysis (ANSYS). The composite of materials is studied separately by
the simulation that is similar to the condition applied in the HDD industry. It is shown that tin is responded to
temperature slower than other composite materials. When material composite is inconsistently mixed in the
solder bump, there is high possibility of fatigue life in solder ball.